CompoundTek’s 8”/12” SiPh Wafer Test Hub commercialises new wafer edge coupling tech

  • Company reaffirms rollout of competitive mass production SiPh Wafer Testing to include “test parallelism”
  • Further improvement of SiPh wafer test time by an additional 40% in the pipeline

Singapore, 1 Oct 2021 – CompoundTek Pte Ltd, a global foundry services provider in emerging Silicon Photonics (SiPh) solution announces the commercialisation of its new wafer edge coupling tech, delivered by the company’s agnostic 8”/12” Silicon Photonics Wafer Test Hub. Billed as Asia’s first facility of its kind, the test hub’s latest collaborative innovation will be available to key customers starting October 2021 and addresses three key areas of SiPh wafer testing: wafer-level edge coupling, test time reduction, and test hardware cost reduction.

The company’s transformative wafer edge coupling solution increases coverage of existing SiPh wafer tests to include detection of failures in edge couplers and can achieve best-in-class coupling loss lower than 2dB per facet as well as high repeatability of measurement with sigma lesser than 0.05dB.

In today’s mainstream SiPh wafer test technology, light is vertically coupled into the device under test (DUT) through grating couplers, an inherent mismatch with actual end-application where light is instead, coupled horizontally into the device at the die edge. This reinforces the gaps between the wafer test environment and final application in SiPh test coverage, a challenge CompoundTek can successfully mitigate by simulating real-world based test scenarios to screen out failures through its advanced wafer-level edge coupling solution. Forming a game-changer for the industry, the solution transforms testing cycle time, reduces cost significantly and improves yield accuracy and supply at the transceiver module level.

Further reaffirming CompoundTek’s commitment to expanding its pipeline of competitive mass production SiPh wafer testing capabilities, is the company’s “test parallelism” project. This phased initiative is poised to improve test cycle time by an additional 40% – making it a likely candidate for the first-of-its-kind service that better integrates the SiPh value chain and solidify the manufacturing ecosystem.

Full press release available below:

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