• Company reaffirms rollout of competitive mass production SiPh Wafer Testing to include “test parallelism”
• Further improvement of SiPh wafer test time by an additional 40% in the pipeline

Singapore, 1 Oct 2021 – CompoundTek Pte Ltd, a global foundry services provider in emerging Silicon Photonics (SiPh) solution announces the commercialisation of its new wafer edge coupling tech, delivered by the company’s agnostic 8”/12” Silicon Photonics Wafer Test Hub. Billed as Asia’s first facility of its kind, the test hub’s latest collaborative innovation will be available to key customers starting October 2021 and addresses three key areas of SiPh wafer testing: wafer-level edge coupling, test time reduction, and test hardware cost reduction.

The company’s transformative wafer edge coupling solution increases coverage of existing SiPh wafer tests to include detection of failures in edge couplers and can achieve best-in-class coupling loss lower than 2dB per facet as well as high repeatability of measurement with sigma lesser than 0.05dB.

In today’s mainstream SiPh wafer test technology, light is vertically coupled into the device under test (DUT) through grating couplers, an inherent mismatch with actual end-application where light is instead, coupled horizontally into the device at the die edge. This reinforces the gaps between the wafer test environment and final application in SiPh test coverage, a challenge CompoundTek can successfully mitigate by simulating real-world based test scenarios to screen out failures through its advanced wafer-level edge coupling solution. Forming a game-changer for the industry, the solution transforms testing cycle time, reduces cost significantly and improves yield accuracy and supply at the transceiver module level.

Further reaffirming CompoundTek’s commitment to expanding its pipeline of competitive mass production SiPh wafer testing capabilities, is the company’s “test parallelism” project. This phased initiative is poised to improve test cycle time by an additional 40% – making it a likely candidate for the first-of-its-kind service that better integrates the SiPh value chain and solidify the manufacturing ecosystem.

Full press release available below:

Singapore, 15 June 2020 – CompoundTek set out to deliver 3-sigma statistical support to provide customers with best-in-class PDK models that are representative of CompoundTek’s proprietary manufacturing process. The goal was to deliver to the marketplace, statistical support with minimal time-to-market, and the company looked for innovative ways to improve its processes for the development and maintenance of PDKs. We combined our know-how with Ansys CML Compiler, a solution for increased automation for building and maintaining compact model libraries (CMLs).

In this CompoundTek-Ansys case study, several areas are explored, demonstrating a better fit of the simulation results with the actual performance. This provides a more accurate prediction of the actual chip performance and yield. With the CML Compiler enabling integration of CMLs with 3rd party EDA tools, customers can link their INTERCONNECT schematic to the layout and perform electro-optical co-simulation.  

Read the full case study here.

Read this technical article of our efforts with Ansys/Lumerical  on developing new ways to improve one of the most complex photonic components, the SiPh grating coupler, by shortening the design cycle and minimising component size to reduce costs to the end user:

https://www.lumerical.com/customer-success/compoundtek/

Singapore, 30 April 2021 – Journalist Antony Savas of Optical Connections Magazine chats with CompoundTek and several industry players on the evolving market for tuneable optics/lasers supporting data centre connectivity, metropolitan connections and links to the edge. Driven by rapidly increasing network traffic and surging bandwidth with unprecedented demand in cloud computing, video-on-demand services, data analytics processing, the Internet of Things, the move to 5G mobile and the feverish building of hyperscale data centres, the global tuneable laser market was valued at $10.12 billion in 2020 and is expected to reach 16.79 billion by 2026, at a compound annual growth rate (CAGR) of 8.7% over the forecast period (Mordor Intelligence).

Evolving form factors to address changing markets are taking shape too. CompoundTEK and Nanyang Technological University (NTU) in Singapore are combining different technologies to address market needs.

KS Ang, chief operating officer at CompoundTek, says, “There are many ways to build a tuneable laser. What sets our technology apart is the ability to integrate with Silicon Photonics (SiPh) devices which offers low propagation loss and high integration densities. In our co-developed solution, the tuneable laser consists of a Ⅲ-Ⅴ gain section and a silicon-based photonic integrated circuit.”

Read the full interview below:

Singapore, 28 March 2020– The wavelength region of about 1650 nm enables pervasive applications. Instances, while not exhaustive, include gas spectroscopy, communications, LIDAR, surgery and medical diagnostics. Silicon photonics is a disruptive photonic, through advanced silicon manufacturing, it is possible to obtain unprecedented levels of integration densities on the platform. Thereby, it would be advantageous for the development of a laser source that operates on the silicon platform, at the abovementioned wavelength region.

In this work, through the hybrid integration between an III-V optical amplifier and extended silicon photonic laser cavity, we demonstrate a hybrid silicon laser that operates from 1647-1690 nm. Output power as high as 31.1 mW is demonstrated. Via integration with silicon photonics technology, the laser is shown to have one of the highest spectral purity in the world.

Read the full research article below:

Singapore, 10 Feb 2021 – CompoundTek Pte Ltd, a global foundry services provider in emerging Silicon Photonics (SiPh) solution and Ansys, a leading developer of photonic design and simulation tools, announce the release of CompoundTek’s Process Design Kit (PDK) version 2.0. With the vision of enabling best-in-class photonic circuit simulation for customers, the version 2.0 PDK Component Model Library supports 3-sigma statistical models in Ansys’ Lumerical INTERCONNECT. Its design is based on CompoundTek’s actual measured 8” wafer-level data of Si/SiN waveguides, both on passive and active photonics components on its SiPh 8” fabricated wafers.

A total of 39 new components in both O and C wavelength band; SiN based Mux/DeMux, terminator, Polarization Rotator Beam Splitter, VOA, SiN based platform etc., are added in this latest PDK release. Nominal compact models have been added to the Component Model Library to enable circuit simulations with these new components. All models are calibrated against measurement data to ensure the highest level of accuracy.

Customers now have access to the 3-sigma statistical model based on the actual wafer measurement data and can factor in the variation of the actual performance when designing their products. A better understanding of the design margin based on the 3-sigma model can now be achieved without the costly and lengthy process of running a process corner check on the actual product, saving both time and money. Enhancing their Design For Manufacturability (DFM) and shortening their time to production, at a much lower cost, the PDK version 2.0 also adds 3-sigma statistical data to 30 active models including photodetectors, ring modulators, and Mach-Zehnder modulators. A better fit of the simulation results with the actual performance results in a more accurate prediction of the actual chip performance and yield.

For more information, please contact enquiries@compoundtek.com

Full press release available below:

Partnership aims to improves Design for Manufacturability

Singapore, 29 Jan 2021 – CompoundTek Pte Ltd, a global foundry services provider in emerging Silicon Photonics (SiPh) solutions announces that it has partnered with Siemens Digital Industries Software  to develop and release CompoundTek’s Process Design Kit (PDK) version 2.0. With the vision of enabling best-in-class photonic circuit simulation for customers, the version 2.0 PDK Component Model Library supports 3 statistical models, based on CompoundTek’s actual measured 8” wafer-level data of Si/SiN waveguides, passive and active photonics components on its SiPh 8” fabricated wafers. 

Formerly Mentor Graphics, Siemens’ Electronic Design Automation (EDA) solutions provide a broad array of design and verification solutions for photonic designers, including L-Edit Photonics and LightSuite™ Photonic Compiler, both of which work with CompoundTek’s 2.0 PDK. These tools provide productivity improvements for photonics experts and IC designers through automation and custom layout. Siemens’ Calibre® verification platform, which includes Calibre nmDRC with its proprietary equation-based functionally, has extended its golden signoff status to include silicon photonic designs.

A total of 39 new components in both O and C wavelength band; SiN based Mux/DeMux, terminator, Polarization Rotator Beam Splitter, VOA, SiN based platform etc., are added in this latest PDK release. The PDK version 2.0 also adds 3 statistical data to 30 active models, including photodetectors, ring modulators, and Mach-Zehnder modulators. It enables CompoundTek customers’ designs to have a better fit of the simulation results with the actual performance, resulting in a more accurate prediction of the actual chip performance and yield.

For more information, please contact enquiries@compoundtek.com

Full press release available below:

Results demonstrate improved optical propagation loss of > 50% better as compared to CompoundTek’s Gen-1 process

Singapore, 11 Nov 2020 – CompoundTek Pte Ltd, a global foundry services provider in emerging Silicon Photonics (SiPh) solution, successfully demonstrated industry-leading performance for silicon waveguide loss for both “O” and “C” band, as part of its technology roadmap for Silicon Photonics. Optical tests have shown these waveguide losses using a newly developed process, delivers better optical propagation loss of > 50% better compared to previous performance running CompoundTek’s Gen-1 process. Representing a significant breakthrough for the industry, the CompoundTek 8-inch silicon waveguide loss is now likely, better than or equal to existing 12” Si photonics commercial foundry.

The C-band propagation loss in TE mode is improved to < 0.5dB/cm, 0.8dB/cm and 0.8dB/cm for 450nm width Si rib deep waveguide, 450nm width Si strip waveguide and 500nm width Si strip waveguide, respectively. The O-band propagation loss in TE mode is now 0.8dB/cm, 1.7dB/cm and 1.9dB/cm for 410nm width Si rib deep waveguide, 410nm width Si strip waveguide and 380nm width Si strip waveguide, correspondingly. Besides the low Si waveguide loss improvement, 8” foundry lower cost advantages with 3µm BOX on 8” SOI wafers as compared to 2µm BOX on 12” SOI wafers are also an additional value-added.

The lower optical propagation loss enable customers’ additional flexibility when designing their new products while improving the performance of existing ones. This breakthrough process is now available and demonstrates the company’s commitment to providing “Best-In-Class” Silicon Photonics solutions through the continued expansion of service capabilities and product portfolio.

Since its launch in 2017, Singapore-based CompoundTek has over 22 global commercial customers and over 25 research institutes and universities in various applications such as telecommunications, automotive radar, data communications, bio-sensing, artificial intelligence (AI), quantum computing and smart sensors etc.

For more information, please contact enquiries@compoundtek.com

CompoundTek’s proprietary test executive launched recently to great fanfare has been developed in response to an oft sought capability for a competitive advantage in the area of Silicon Photonics (SiPh) wafer testing. Designed to transform tests from a semi-automated to a fully automated system with minimum human intervention, it additionally incorporates AI and machine learning capabilities.

This technical paper begins by discussing findings of the test executive system after being put through its paces, proving to be able to reduce total test time for SiPh wafer by up to 40%.

The Modulator, while a critical component of a SiPh product, is likely the most complicated to test. Forming a major roadblock to full automated testing, this paper, a combined effort of Nanyang Technological University School of Electrical and Electronics Engineering Department and CompoundTek, expounds the use of SciPy, and how it can address modulator test complications.

The SciPy is an open-source scientific computing library used by CompoundTek’s test team and has produced several positive indicators including efficiencies from a fully automated modulator test and SiPh wafer test capabilities.

For more information, contact enquiries@compoundtek.com

Read the full Technical Paper below:

Presentation titled “Layout Standardisation Proposal to realise fully automated Silicon Photonics Wafer Test” to be discussed 20th – 21st Oct 2020

Singapore, 7 Oct 2020 – CompoundTek has been invited to present in the International Electrotechnical Commission (IEC) 2020 SC 86C technical committee meeting to be held 20^th and 21^st Oct. Founded in 1906, IEC is the world’s leading organisation for the preparation and publication of International Standards for all electrical, electronic and related technologies. These are known collectively as “electrotechnology”. IEC provides a platform to companies, industries and governments for meeting, discussing and developing the International Standards they require.

The SC86C sub-committee covers the preparation of international standards for fibre optic systems and active devices embracing all types of communications and sensor applications. This includes terminology, characteristics, test and measurement methods and functional interfaces including all mechanical, environmental, optical, and electrical requirements to ensure interoperability and reliable system performance.

CompoundTek Director of SIPh Test, (Dr) S.L.Tan will be talking about “Layout Standardisation Proposal to realise fully automated Silicon Photonics Wafer Test”. During the presentation, he will be discussing the motivation and importance of creating a set of layout rules to achieve efficient, fully automated test which will greatly drive down test turnaround time and costs – further accelerating industry’s adoption of SiPh wafer level test. 

Since its launch in 2017, Singapore-based CompoundTek has more than 20 global commercial customers in over 9 countries and over 20 leading Research Institutes and Universities in various applications such as telecommunications, automotive LiDAR, data communications, bio-sensing/bio-medical, artificial intelligence (AI), quantum computing and smart sensors.

For more information, please contact enquiries@compoundtek.com

CompoundTek’s services to be offered as part of the company’s future-focused development in 8”/12” agnostic Silicon Photonics Wafer Test Hub

Singapore, 24 Sep 2020 – CompoundTek Pte Ltd, a global foundry services provider in emerging Silicon Photonics (SiPh) solution confirms its future-focused development for 8”/12” agnostic Silicon Photonics Wafer Test Hub. Expansion efforts will be centred on addressing two key areas of market demand – wafer-level edge coupling capability and test time reduction for commercial product companies.

Today, the SIPh wafer test is performed by vertical optical coupling of the light into the device under test (DUT), contrary to actual end-application where light is coupled horizontally into the device through the coupler at the edge of the die. Creating a mismatch between the wafer test environment and final application often leads to potential gaps in SiPh test coverage, reinforcing the need for real-world based test scenarios to screen out failures.

Development of CompoundTek’s new wafer edge coupling technologies is a game-changing solution that sets out to increase coverage of existing SiPh wafer test by including the detection of fails due to edge couplers.

Scheduled to be offered to key customers from Q1 2021, the wafer-level edge coupling capability is being developed alongside expansion efforts of the company’s Test Executive Systems (TES). Representing a key challenge to broader market SiPh adoption, long test time per wafer – varying from 36 hours to as long as 96 hours, depending on the test type needed and coverage, is unlike the well established CMOS logic product supply chain.

Long test time is attributed to the complex opto-electrical (DC and RF) tests, and without a standardised SiPh wafer test solution capable of balancing test coverage with competitive test time, successful integration of optical components on a chip for SiPh devices is delayed, creating roadblocks to mass-market adoption of SiPh technologies.

Recent breakthroughs by CompoundTek’s optimisation of its proprietary TES executive can potentially reduce customers’ product test time by up to 40% – to as short as 1.5 hours (from 2.5 hours) or 70 hours (from 96 hours). Enabling large volumes of device-performance data necessary to carry a design from concept to qualification and subsequently into production, TES aims to accelerate market adoption of wafer-level SiPh test services.

Full press release below: